NXP (formerly Freescale) QorIQ T2081, T1042, or T1022 Processor-Based Conduction-Cooled XMC/PrPMC Mezzanine Module. A ternary biochar/vanadium pentoxide/graphite like carbon nitride (BC/V2O5/g-C3N4 denoted BC/VO/CN) composite was prepared by a simple hydrothermal method and its. Bringing the NI Ettus Research USRP E320 to the VPX form factor, the VPX3-E320 is a ruggedized, user-programmable software-defined radio, ideal for low-to-medium bandwidth RF applications and aligned to The Open Group Sensor Open Systems Architecture™. OpenVPX is the architecture framework that defines system level VPX interoperability for multi-vendor, multi-module, integrated system environments. Some cards, especially FPGAs, may approach 300 watts per slot, which can be a challenge even for liquid cooling. 5, air flow-through, which has the advantage of being able to meter the air to specific cards. 0 in. 3 to the P15 connector for interfacing with the host module. or 1. The SP306R-VPX StorePak™ is a removable single slot air-cooled 3U VPX storage module designed to be used either in conjunction with Critical I/O’s StoreEngine storage manager, or as a stand-alone Direct Attach Storage device. The IC-INT-VPX3k is a 3U VPX Single Board Computer built around the Intel® Xeon® W (code name Tiger Lake-H) processor. DECISIVE PERFORMANCE. Designed to meet the requirements of VITA 62 for use in harsh environments. With a total of six high-performance Gigabit Ethernet interfaces (2 routed, 4 switched), the 3U conduction-cooled (VITA 48. 1 * Kintex® UltraScale™ FPGA. Works With: Subracks; Cases. 3U VPX (OpenVPX Compliant) Environmental Specifications Temperature Limits. Chassis Cooling Forced Air Conduction Cooled Cold Plate Mounting, Convection Cooled (Fins Only), Liquid Cooled (Heat exchangers available by request)Load board for VPX systems, meets ANSI/VITA 46 mechani-cal and electrical connection standards Convection and conduction-cooled versions available Verifies chassis can meet power requirement and specifica-tions for VPX Assists in locating hot spots in the chassis Go/No-Go indicators for 12V, 3. 6U Board with aluminum heatsink. Combined with IC’s ComEth4582a 10 Gigabit Ethernet router or hybrid ComEth4410a switch (PCIe & Ethernet) and other IC’s Processor/FPGAs boards with. PXI / PXIe Chassis. 2 specification. This 3U Module enables an isolated thermal path Air Flow Through (AFT) – ANSI/VITA 48. With two PCI Express Fat Pipe P1 interconnects and two Gigabit Ethernet ports, the XPedite7477 is ideal for the high-bandwidth and processing-intensive demands of today's. Air-cooled, conduction-cooled and REDI versions; 3U Single XMC slot; PCIe x8 Gen 2 interface; The VPX4812A can be used as a VPX switch card allowing a host CPU to communicate with up to 3 downstream cards in addition to the XMC card. Visit Product page. View product Compare. 1” Pitch (Conduction Cooled) 0. It is available in air. 2 struggles to dissipate the attendant heat using straight conduction cooling – leaving system designers with only two choices; move to VITA REDI alternatives or stick with VITA 48. The Chassis CPU will monitor and maintain the VPX module wedge. View. FEATURES. The up to 800 Watt power output true 6. A x8 PCI Express 2. ANSI/VITA 48. Conduction cooled card guide for Dawn DC- (n) Series air cooled development chassis. Single Slot 3U VPX Board Features • Largest available capacity in a single 3U VPX slot with dual SATA drives o Compliant with OpenVPXTM (VITA 65). 3U VPX, 6U VPX, and OpenVPX-based SBCs, I/O, storage, switches, rugged systems, and development platforms featuring Intel Core i7, Intel Xeon D, & Freescale QorIQ T-Series and P-Series processor technology. 3 V. 0 VPX Base Standard VITA 46. The DK3 is part of the LCR family of benchtop development solutions supporting VPX system development and the hardware convergence and interoperability initiatives of the US Department of Defense. 0 in. The chassis is designed for plug in cards in alignment with the SOSA technical standard. The high-performance VX305C-40G is available in both air-cooled (for lab or other benign deployed environments) and conduction-cooled Plug-in units as per VITA 48. 625 IN : Model Number:2. or 1. AoC3U-210: air over conduction cooled 2 slot 3U VPX ATR chassis for 3U VPX and SOSA aligned plug in card payloads. Compatible to both air cooled and conduction cooled. 3U VPX Form Factor, 1” Pitch (conduction cooled) 4, or 8 Lane (factory configured) PCI Express 3. Intel® Xeon® D-1500 Processor-Based Rugged Small Form Factor (SFF) COTS System with Xilinx Kintex® Ultrascale™ FPGA. The first100GbE 3U VPX SBC on the market aligned to SOSA 1; Up to 256 GB M. 85" pitch ver-sion allows for the top and bottom coversDesigned specifically for high-powered, conduction-cooled modules, the AVRO-2 is a compact solution in a 2-slot 3U VPX chassis. The specification of 6U VPX calls for computer cooling via a conduction-cooled envelope compliant with the IEEE standard IEEE-1101. 2 for conduction cooling • VITA 46 board connectors • IEEE 1101. 3U Conduction cooled models available in 1″ form factor. These PSUs are available in 3U or 6U form factor. 0 VPX: Coaxial Interconnect – Base Standard. Fax: (604) 875-5867. 3 slot apertures for a variety of RF and optical I/O connectors targeting a range of applications. 2, 2022 Edition, 2022 - Mechanical Standard for Conduction Cooling VPX. Form Factor. 8”. 5"L x 5. A Tour of VITA AFT Cooling Standards in 2023 For critical and intelligent deployed embedded modules, air-flow-through (AFT) cooling describes an approach that brings the coolant much closer to heat-generating electronics than standard conduction-cooled approaches. View. 0 port is routed per VITA 42. Development chassis for VPX and SOSA aligned module payloads. Conduction or air cooling. 1-1997. Related standards not addressed in this paper, and specifying conduction cooled implementations for Eurocard, are VITA 48 describing VPX VITA 46 mechanical implementations and VITA 57 dealing with FMC mezzanines. Dawn’s VPX backplanes support development systems, deployable rack mount and mission critical systems for convection and conduction cooled modules. Conduction-Cooled Option. 2) where keying as defined in the VME64 Extensions standard cannot be applied. The XPedite7672 is an optimal choice for computationally heavy applications. The Behlman VPXtra® series of COTS AC to DC and DC to DC power supply are rugged, highly reliable, conduction cooled, switch mode unit built for high-end industrial and mission critical military. 3U VPX-REDI conduction-cooled form factor; Dimensions: 100 mm x 160 mm; 0. 0 in. Study, diagrams and routing of the VPX and cPCI dual bus integrating high-speed links between. 1 switch and 10G backplane Ethernet switch in a single 3U module, enabling you to connect between a wide range of module types – including those with earlier Gen 1 or Gen 2 PCIe interfaces. Products. It provides 550 W of total simultaneous power, which can be distributed as up to 8 A on 12 V, up to 80 A on 5. Development chassis for VPX and SOSA aligned module payloads. Ethernet. OpenVPX (VITA 65. PWB area and improved thermal management (air-cooled, conduc-tion-cooled, liquid flow-through cooling), enabling increased func-tional density and providing support for use as an LRM. 6U/ 5HP VPX load card, conduction cooled. RuSH controlled power and cooling supports high current demands and corresponding high cooling. View product. 100 Ohm differential pair routing. The XPand1015 can be configured as two I/O isolated slots, with all I/O from the payload passed to the RTM. Length: 160 mm. FREMONT, Calif. Technical Specs Accessories Documentation Block Diagram The XPand1200 is a low-cost, flexible development platform, supporting up to eight 0. Provides up to an 8-slot system for 3U convection cooled boards and 3U transition modules on 1. This enables the VX305C-40G to sustain 70°C card edge temperature according to VITA 47 XMC support. VPX is a broadly defined technology utilizing the latest in a variety of switch fabric technologies in 3U and 6U format blades. All offers are typically available for. Heat generated inside the chassis by the electronics flows into the chassis aluminum sidewalls and down into the cold plate. 3U VPX-REDI conduction- or air-cooled form factor; Dimensions: 100 mm x 160 mm; 0. The XPand1015 system is a low-cost development platform for conduction-cooled 6U VPX cards. Up to 32GB of high-speed. 4. 3V, 5V, +12V_Aux,ANSI/VITA 48. ENHANCE THE PERFORMANCE & RELIABILITY OF YOUR SYSTEM WITH ONE DESIGN DECISION. Intel Xeon Quad Core Xeon E3-1505M V5 (47W) Intel C230 series CM236 PCH chipset; Up to -40 to 85°C extended operating range; Programmable CPU power for heat sensitive apps. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A on 3. Utilizing our extensive experience in embedded. This extensive line includes conduction cooled VPX, air cooled VPX, as well as VPX ATR configurations. The versatile design allows multiple customizable configurations based on proven components and design techniques. -No. 08 of Vita65. 3 slots – ROHS and CE compliant articLe part. LCR’s product line of rugged ATR chassis and integrated systems offer VPX packaging solutions for applications requiring 1-slot to 18-slots. For use in DC systems, they are 3 U high by 5 HP (1-inch) wide modules with guide blocks, for use in conduction cooled VPX systems. The XPort3305 is a conduction-cooled dual 10 Gigabit Ethernet XMC with front and rear panel I/O support. Downloads. Ideal for SBCs or carriers for VPX, VME and cPCI (Compact PCI/PCIe or PXI) - Commercial or Rugged/Conduction Cooled Systems. The 3U VPX XMC Carrier is a rugged conduction cooled single slot 3U VPX XMC Carrier that can connect one XMC module to a standard VPX backplane using PCIexpress 1x 8lane or 2x4 lane configurations. or 1. 0, 2. 2 RS-232, 2 RS-232/422/485 Chassis Type: Sub-½ ATR Number of Slots: 2 Chassis Cooling: Conduction-Cooled, Natural Convection-Cooled. The result is a powerful and flexible I/O processor module that is capable of executing custom instruction sets and algorithms. Five slots 3U VPX conduction cooled Chassis. PCIe. 8 in. Slots. The VPX340 (400W) and VPX336 (360W) can be used to power VPX / Open VPX chassis and will fit into the standard. WOLF carrier boards are designed to provide system designers with a flexible, highly configurable PCI Express interface. Most VPX systems make use of VITA 48. 3 V. VENRAY, the Netherlands July 21st 2010 - VSN Systemen bv, a leading telecom hardware and software developer, launches OpenTSP NG technical building blocks,which are essential for the development of the newest multimedia applications. 5” x 7. However, as module power continues to increase, VITA 48. Eight 6U VITA 48. The Chassis Manager is VITA 46. Description. These Single Board Computers from X-ES are available in air-cooled and conduction-cooled versions to support a wide variety of applications across multiple industries. Compare Products. Best Application: Where shock, vibration, and air contaminants are not an issue. Ideal for rugged deployed, mobile applications. It supports 3rd Gen Intel Core series processor and Intel QM77 chipset. 6-Slots of 3U VPX with integral 6-channel intelligent 400W power supply. 2) modules. Each DCM has 3Commercial Air-Cooled. VPX MEDIA CONVERTER MODULE SUMMARY CF-020010-57X 57X Block Diagram VITA 48. Convection Cooled: SMA Jack (+3. XMC slot. 2 applies to 3U and 6U VPX embedded computing modules, and defines the dimensions of plug-in units for conduction-cooled applications and connector-mounting details, as well as key sub. Power Supplies are available in 3U and 6U, in air- and conduction- cooled form factors >for cPCI, VPX, VME64x & custom applications. It can support several Atrenne 3U backplanes, including variants supporting Gen-3 10 Gbaud, or a custom backplane. Aisle Containment. M4067 is a military grade 6U VPX, 115VAC 3 phase, AC-DC PSU card that provides six outputs per VITA 62 and is rated at 700W output power. 2) modules. VITA 62 power connector. 2 for conduction cooling • VITA 46 board connectors • IEEE 1101. Eight 6U VITA 48. Conduction cooled VPX modules require that there be no front panel IO; Improved modularity and scalability of complex architectures; Coaxial interconnects in modules can significantly improve isolation from interference and noise. The 12 slot power and ground backplane supports VITA 48. 8 in. 950 inch Standard Conduction Cooled VITA Card in SOLIDWORKS. AoC3U-610 Conduction Cooling with Air Assist. Signal rate: 3. High performance 3U or 6U single board computers feature air or conduction-cooled options. Item/Part Number: 1940000376-0000R Product Features. 8 in. 1x 100GBase-KR4, 1x 10/25GBase-KR. 2) modules. 2 Type 2, Secondary Side Retainer. Part of our 1400 Series of conduction cooled enclosures with air assist, the 1440 is designed to maintain safe operating temperatures for high slot count 3U VPX systems and may be used as a deployment or development chassis. These rugged power supplies are available in 200W-1300W power configurations. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A on 3. Block Diagram. N/A. 0 in. 6GHz Thirty-two. Embedded RuSH TM technology. 4, liquid flow-through, probably the most efficient up to 450 watts per card. Form Factor: 6U VPX Chassis Type: Development Number of Slots: 2 Dimensions: 17. (VPX / cPCI/ VME) and custom designs. pitch conduction-cooled VPX (VITA 48. A hybrid switch with 24 ports 32 lane PCI Express Gen 1 / Gen 2 and additional 9 port Gigabit Ethernet switching capabilities provides for highest bandwidth. Conduction-Cooled 3U VPX-REDI XMC Carrier Card. Part of our AoC3U-800 Series of rugged packaging solutions, the AoC3U-821 enables high slot count systems in a precision engineered chassis for 3U VPX and SOSA aligned plug in card payloads. 85 and 1. 65 in. Removable drive modules rated for 100,000 mating cycles. MEMKOR VPX series offers deployment flexibility through a highly rugged military-grade 3U OpenVPX storage module. available in air cooled or conduction cooled with thermally efficient heatsink technology and rear I/O. Spare Power Supplies for W-IE-NE-R NIM and CAMAC chassis, providing high power density and low ripple and noise. 3U VPX 40G Ethernet Switch | Layer 2 Switching Conduction-cooled 3U VPX Ethernet switch module. The ICE-Lok® thermally enhanced Wedge. View product Compare. 3. The chassis combines forced air with conduction cooling to dramatically increase thermal. Created Date: 3/20/2017 10:06:58 AM. A XMC module can therefore have two PCIexpress chips on board without using an additional switch on the XMC board. The DK3 supports VPX development and integration activities for high speed C4ISR (Command, Control,. 2 (REDI) )0 inch pitch conduction cooled payload slots in Long format (# of slots in Short format TBD) Configurable rigid front I/O PCBA and 7. 6U VPX Load Board, conduction-cooled 6U x 160mm, conduction-cooled . The VPX Timing Clock offers a complete solution set for all PNT needs. 8 in. Graphics Processing Units (GPUs) LCR Embedded Systems’ fully integrated, conduction-cooled, featherweight 2-Slot VPX System (shown at right) will break new ground in addressing the concerns of UAV application developers and allow for the massive expansion of payload performance and processing power for autonomous vehicles. Part of our 1400 Series of conduction cooled enclosures with air assist, the 1440 is designed to maintain safe operating temperatures for high slot count 3U VPX systems and may be used as a deployment or development chassis. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5. 35mm X 160mm] for circuit Boards & plug-in units with AIR or Conduction cool mechanism The base Mechanical specifications of PCB & Plug-In units are defined by VITA46 The Allowable Standoff Height for PMC/XMC is 10mm where 0. 0 in. 1. 3U VPX VITA 67 Development Platform for Conduction-Cooled RF Modules and Intel® Core™ i7 Processor-Based Module. Our expertise also includes VITA 66,. Contact factory for appropriate board configuration based on environmental requirements. Supported ruggedization levels (see the X-ES. Formally known as ANSI/VITA 48. XIt1076 (90060330) - 3U VPX Rear Transition Module with Gigabit Ethernet, SATA, USB, Serial, and DisplayPort XIt1086 (90040055) - 3U VPX RTM with Serial, Ethernet, USB, SATA, PCIe XPand1004 (90071810) - Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O XPand1200 (90070530) - 3U. XIt1086. The XPedite7770 is a secure, high-performance single board computer based on the Intel® Xeon® D-1700 series (formerly Ice Lake-D) of processors, making it an optimal choice for computationally heavy applications requiring. Form Factor: VPX Size: 3UConduction cooled at card edge (Air Flow Over available) Conformal coating on PWB; 6U VPX VITA 62 High Power Supplies with Auxiliary voltage. Elma Bustronic Corp. The logic-optimized FPGA is well-suited for a. 0 Reviews. AT-VPX-Carrier carrier card offers maximum flexibility to system. Elma’s latest 6U VPX load board comes in a conduction-cooled format as per the IEEE standard 1101. slots support conduction-cooled 3U VPX, 3U cPCI, or power supply modules. The XPand1303 is a low-cost, flexible, development platform. Nerve conduction studies (NCS) are tests used to evaluate the function of the peripheral nerves. 8 in. View product. These Single Board Computers from X-ES are available in air-cooled and conduction-cooled versions to support a wide variety of. 3 V. 8-2017, “Mechanical Standard for Electronic VPX Plug-in Modules Using Air Flow Through Cooling” was developed and promoted by a working group sponsored by Lockheed Martin,. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. The DCMs pro-vides RF to IF conversion (where necessary), pre-selection, and gain equalization. 3U VPX Conduction Cooled Carrier with PCIe Interface and Removable NVMe SSD Module RRT-3UVPX-NVMe-R-C NVMe SSD Connector Removable SSD Slot Module P0 PCIe x4 EP00-EP03 or P1 EP04-EP07 P2 SOSA Aligned Slot Profile: SLT3-PAY-1F1U1S1S1U1U2F1H-14. In some ways, AFT is a hybrid between air and conduction cooling, but with greater cooling capability. Performance “Eye”-tested and Dawn patented Fabric Mapping Modules allow. A x8 PCI Express 2. ,Ltd. 1 compliant products to extend the temperature range of operation to drive the costs down To keep the weight low to avoid the use of other less cost effective solutions based for instance on the VITA 48. XIt1097 (90074535) - 3U VPX Rear Transition Module with 40 Gigabit and 10 Gigabit Ethernet, USB, Serial, and XIM Site XPand1007 (90075300) - Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O XPand1203 (90072665) - 3U VPX Development Platform for Up to Eight Conduction-Cooled. 6. 30 in. 8 in. Mobile workstation processor performance with enterprise-VPX Meritec Cable Module (Odd or Even) Daughter Card for Host board (Air or Conduction cooled). 00" pitch. Of the two VPX mechanical form factors, 3U is very popular in certain applications, and 6U is sometimes necessary to build highly parallel systems with optimal computing density. 2 conduction cooled configuration and ready for rugged applications. 2 conduction cooled modules because of their established deployment track record. 8-2017, “Mechanical Standard for Electronic VPX Plug-in Modules Using Air Flow Through Cooling,” is a bit long-winded, but it’s essentially an air-cooled standard. Two-Slot 6U VPX Development Platform for Conduction-Cooled Modules with RTM I/O. Motorola – Single board chassis design with natural convection requirement. High-Performance 3U VPX Connectivity. 4 PTC resistors (TMP300 IC); one each at the front at bottom and top as well as rear top and bottom, analog output 10mV/°C (typical 750mV ±30mV at 25°C), Optional DVM plug-on board, Voltage and temperature sense lines are connected to 2 x 8 pin header (X1 connector) on front panel, Voltage levels for. Form Factor: 3U VPX. VPX 3U. (L) x 4. 2 Type 2, Secondary Side Retainer. This Model Can be used to design the VITA Card Chassis. 1 file(s) 861. Acromag VPX products are designed for COTS applications. The XMC-1553 is the Only Commercial Off the Shelf (COTS) Card that Passes and Executes the SAE AS4111/4112. 3U VPX Graphics. VITA 48. The XPedite8171 is an Intel® Atom™ E3800-based 3U VPX-REDI single board computer available in conduction- and air-cooled configurations. SE306S-CCVPX- Conduction 6 SSD XMC Yes 6 GB/s 12TB No StoreEngine 3U Air Cooled VPX SE300‐VPX‐ND accomodates standard I/O XMCs StoreEngine 3U Conduction Cooled VPX SE300‐CCVPX‐ND accomodates standard I/O XMCs via a removable front panel/heat frame element StoreEngine 3U Air Cooled VPXThe VPX CUBE features 4 slots of 3U VPX on a 1″ pitch high bandwidth backplane and an integrated, wide temperature range 400 Watt power supply. Rugged Conduction Cooled Assemblies and Modules. High Performance Embedded Computing. This allows for all the slots to be on the same non-blocking Ethernet switch instead of two switches chained. 62H. VPX 3U Load Board - Conduction cooled: LXH0000840. FPGA BSP (FBSP) High-Speed Links (HYDRA) Advanced Board Management Controller (aBMC) Highlights. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A on 3. 3U CompactPCI Development Platform for Up to Eight Conduction-Cooled Modules. The design incorporates a Blu-Ray drive, SBC, Power Supply and ECS (Environmental Control System). 0 and VITA 65 connector interoperability. This platform supports up to eight 0. This design and development were by MSS, including all the Windows-based software and qualification to full DO-160. 0 in. Accessories. VPX-TF3090 3U VPX conduction cooled test frame with tBP-VPX3000. These rugged power supplies are available in 200W-1300W power configurations. The AoC3U-400 Series of chassis use leading edge technology to manage high heat dissipating board payloads. Go-No-Go indicators for 12V, 3. 8 Air Flow Through Cooling; Powerful push-pull cooling of front cards. 2 • 3U or 6U configurationsANSI/VITA 48. 2 (REDI) and VITA 65 (OpenVPX™). conduction or air-cooled modules. View. Trident’s rugged small form factor (SFF) commercially off the shelf (COTS) embedded computer is designed for harsh environments of military, aerospace and heavy industries and addresses the challenging need for many space constrained applications in avionics, aerospace and defense industries. Hover over a product and select Compare to add to comparison set. For all rugged environments: Air, Land, and Sea. 0 in. 2-7. 14 Slot VPX Conduction-Cooled System with Air Assist. 3U Open VPX, MOD3-SWH-2F24U module; Air-cooled - Backplane: 22x 10GBase-KR, 1x 10/100/1000Base-T user configurable front panel or backplane. It supports up to two 0. 2 3U VPX chassis. Usually the test adapter includes fields for voltage and amp, current measurements and in some cases also some pins for wire wrap to conduct custom. Kontron's selection of VPX switches includes fully managed 10 Gigabit Ethernet switching and up to 28 ports Gigabit Ethernet switching. 5, and Vulkan 1. Up to four power supplies can be paralleled to increase. This short 1/2 ATR ships with a 6-slot OpenVPX™ backplane and can accommodate other architectures such as 3U CompactPCI® and MicroTCA™. or 1. Chassis Example: WILD40 Forced-Air, Conduction-Cooled 3U OpenVPX Chassis has an operating temperature of –40˚C to +70˚C. 2 Advanced Thermal Solutions High speed VPX systems demand advanced solutions to manage hot, power hungry board payloads. 1) modules. Sub-½ ATR, Conduction- or Convection-Cooled Chassis Supporting Conduction-Cooled VPX and XMC or PMC Modules. 3 Slot to 5 Slot each. or 1. Pixus also provides conduction-cooled and customized OpenVPX enclosure solutions. The XPand1007 can be configured as two I/O isolated slots, with all I/O from the payload passed to the RTM. StoreEngine is designed to work as a standalone single slot storage device with. Conduction-Cooled Option. Related products. VPX7652. 0 in. 8 in. View product. Power and reset LEDs are provided for. 8 in. Ideal for SBCs or carriers for VPX, VME and cPCI (Compact PCI/PCIe or PXI) - Commercial or Rugged/Conduction Cooled Systems. LOWER RISK. 2 extraction levers and performance wedge locks • 3X - Samtec HQDP connectors for 1G. Compare. Three tri-color front panel LED’s to. Sub-½ ATR, Conduction-Cooled Chassis for Conduction-Cooled Modules. pitch with solder-side cover; Environmental Requirements. 2. The XPand1203 is a low-cost, flexible, development platform. High bandwidth multiGig RT connector for VPX boards; Air- cooled and conduction-cooled versions; Overview. "With its optimized cooling path and quick turn customization of the. 8 in. ANSI-VITA 48. Data Plane. XPand1007. Air-cooled, conduction-cooled, REDI versions; 3U single PMC/XMC slot; PCIe x8 Gen 2 interface; These 3U mezzanine carrier cards provide a simple and cost-effective solution for interfacing a PMC or XMC module to a VPX computer system. 88 in. A network-attached Flyable Data Loader (FDL). 3V_Aux. Conduction- or Air-Cooled 3U VPX-REDI XMC/PMC Carrier Card. The modules can be easily tailored to suit individual requirements, VPX Test Adapter. Most VPX systems use VITA 48. The XPand1010’s design eliminates card cages, rear transition modules, and large noisy fans. The VPX340 and VPX336 series are commercial off-the-shelf (COTS) conduction-cooled, ruggedized, small-form-factor power supplies according to the VITA 62. Physical Characteristics. Compare. All modern operating. VITA. The logic-optimized FPGA is well-suited. Abaco Announces Production of. 10 Rear transition module on VPX VITA 46. 2) VPX router serves as an aggregation point for Read More → "Elma’s Newest Cisco Router Installed on a. pitch conduction-cooled VPX (VITA 48. The Atom™ E3800 processors provide excellent computational performance and I/O functionality for. We offer air & conduction cooled power supply units for wide range AC as well as DC input. Of the two VPX mechanical form factors, 3U is very popular in certain applications, and 6U is sometimes necessary to build highly parallel systems with optimal computing density. Data Center Solutions. 88 in. PCI-SYSTEMS Inc. 3U VPX VITA 67 Development Platform for Conduction-Cooled RF Modules and Intel® Core™ i7 Processor-Based Module The XPand1202 provides a low-cost, flexible, VITA 67 development platform. pitch without solder-side cover (optional) 1. It can operate up to 85 °C card edge temperature according to VITA 47 Product Features.